OS GSO IEC 60191-6-18:2015
IEC 60191-6-18:2010
Omani Standard
Current Edition
·
Approved on
03 September 2015
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
OS GSO IEC 60191-6-18:2015 Files
English
40 Pages
Current Edition
Reference Language
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OS GSO IEC 60191-6-18:2015 Scope
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
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